Inventor
FENG YAO-HSIN
TW8 patents
Patents
8 patentsUS6483187B1Nov 19, 2002
Heat-spread substrate
ADVANCED SEMICONDUCTOR ENG61 citations93
US7122459B2Oct 17, 2006
Semiconductor wafer package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG11 citations82
US7115484B2Oct 3, 2006
Method of dicing a wafer
ADVANCED SEMICONDUCTOR ENG13 citations82
US6768332B2Jul 27, 2004
Semiconductor wafer and testing method for the same
ADVANCED SEMICONDUCTOR ENG16 citations81
US7229846B2Jun 12, 2007
Semiconductor package having an optical device and a method of making the same
ADVANCED SEMICONDUCTOR ENG7 citations71
US6392424B1May 21, 2002
Press plate of wire bond checking system
ADVANCED SEMICONDUCTOR ENG3 citations61
US6172318B1Jan 9, 2001
Base for wire bond checking
ADVANCED SEMICONDUCTOR ENG4 citations61
US6429049B1Aug 6, 2002
Laser method for forming vias
ADVANCED SEMICONDUCTOR ENG3 citations57