Inventor
KUMAMOTO TAKASHI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KUMAMOTO TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS7145226B2Dec 5, 2006
Scalable microelectronic package using conductive risers
INTEL CORP64 citations97
US7138709B2Nov 21, 2006
Microelectronic package array
INTEL CORP67 citations97
US6794751B2Sep 21, 2004
Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
INTEL CORP50 citations95
US6632704B2Oct 14, 2003
Molded flip chip package
INTEL CORP31 citations92
US7132311B2Nov 7, 2006
Encapsulation of a stack of semiconductor dice
INTEL CORP41 citations90
US7071572B2Jul 4, 2006
Pre-back-grind and underfill layer for bumped wafers and dies
INTEL CORP11 citations83
US6838313B2Jan 4, 2005
Molded flip chip package
INTEL CORP16 citations83
US7132739B2Nov 7, 2006
Encapsulated stack of dice and support therefor
INTEL CORP14 citations82
US10224290B2Mar 5, 2019
Electromagnetically shielded electronic devices and related systems and methods
INTEL CORP2 citations68
US8969134B2Mar 3, 2015
Laser ablation tape for solder interconnect formation
INTEL CORP2 citations56
HONDA MOTOR CO LTD
4 patentsUSD1036336SJul 23, 2024
Instrument panel for an automobile
HONDA MOTOR CO LTD19 citations94
USD837118SJan 1, 2019
Instrument panel
HONDA MOTOR CO LTD24 citations88
USD1036337SJul 23, 2024
Front door lining for an automobile
HONDA MOTOR CO LTD3 citations66
USD1121519SApr 7, 2026
Instrument panel for an automobile
HONDA MOTOR CO LTD0 citations60