Inventor
SHIRASAKA KENICHI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “SHIRASAKA KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YAMAHA CORP
21 patentsUS7290448B2Nov 6, 2007
Physical quantity sensor, lead frame, and manufacturing method therefor
YAMAHA CORP50 citations96
US7595548B2Sep 29, 2009
Physical quantity sensor and manufacturing method therefor
YAMAHA CORP39 citations92
US7397112B2Jul 8, 2008
Semiconductor package and lead frame therefor
YAMAHA CORP26 citations92
US7187063B2Mar 6, 2007
Manufacturing method for magnetic sensor and lead frame therefor
YAMAHA CORP12 citations92
US7170149B2Jan 30, 2007
Semiconductor device and package, and method of manufacture therefor
YAMAHA CORP22 citations92
US6979910B2Dec 27, 2005
Semiconductor package and semiconductor package mounting method
YAMAHA CORP12 citations84
US7607355B2Oct 27, 2009
Semiconductor device
YAMAHA CORP13 citations83
US7554182B2Jun 30, 2009
Semiconductor device and package, and method of manufacturer therefor
YAMAHA CORP6 citations74
US7541665B2Jun 2, 2009
Lead frame for a magnetic sensor
YAMAHA CORP4 citations74
US7541294B2Jun 2, 2009
Semiconductor package and semiconductor package mounting method
YAMAHA CORP7 citations73
US7829982B2Nov 9, 2010
Lead frame, sensor including lead frame and method of forming sensor including lead frame
YAMAHA CORP5 citations63
US7754130B2Jul 13, 2010
Method for manufacturing physical quantity sensor
YAMAHA CORP2 citations63
US7727793B2Jun 1, 2010
Physical quantity sensor and manufacturing method therefor
YAMAHA CORP2 citations63
US7494838B2Feb 24, 2009
Manufacturing method for magnetic sensor and lead frame therefor
YAMAHA CORP2 citations63
US7791180B2Sep 7, 2010
Physical quantity sensor and lead frame used for same
YAMAHA CORP5 citations62
US7195953B2Mar 27, 2007
Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
YAMAHA CORP3 citations62
US6861282B2Mar 1, 2005
Semiconductor package and semiconductor package mounting method
YAMAHA CORP1 citations62
US7867827B2Jan 11, 2011
Physical quantity sensor, lead frame, and manufacturing method therefor
YAMAHA CORP0 citations52
US7319042B2Jan 15, 2008
Method and apparatus for manufacture and inspection of semiconductor device
YAMAHA CORP1 citations52
US7964942B2Jun 21, 2011
Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same
YAMAHA CORP1 citations42
US7524696B2Apr 28, 2009
Sensor including lead frame and method of forming sensor including lead frame
YAMAHA CORP0 citations41