Inventor
RAMIAH CHANDRASEKARAM
US13 patents
⚠️ This page may combine multiple inventors who share the name “RAMIAH CHANDRASEKARAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
3 patentsUS5539249AJul 23, 1996
Method and structure for forming an integrated circuit pattern on a semiconductor substrate
MOTOROLA INC36 citations96
US5378659AJan 3, 1995
Method and structure for forming an integrated circuit pattern on a semiconductor substrate
MOTOROLA INC69 citations96
US5639687AJun 17, 1997
Method for forming an integrated circuit pattern on a semiconductor substrate using silicon-rich silicon nitride
MOTOROLA INC90 citations93
FREESCALE SEMICONDUCTOR INC
3 patentsUS8344503B2Jan 1, 2013
3-D circuits with integrated passive devices
FREESCALE SEMICONDUCTOR INC18 citations92
US7935571B2May 3, 2011
Through substrate vias for back-side interconnections on very thin semiconductor wafers
FREESCALE SEMICONDUCTOR INC18 citations92
US7803714B2Sep 28, 2010
Semiconductor through silicon vias of variable size and method of formation
FREESCALE SEMICONDUCTOR INC19 citations83
INVENSAS CORP
3 patentsUS9698131B2Jul 4, 2017
Methods of forming 3-D circuits with integrated passive devices
INVENSAS CORP6 citations84
US9837299B2Dec 5, 2017
Methods of forming 3-D circuits with integrated passive devices
INVENSAS CORP0 citations52
US9236365B2Jan 12, 2016
Methods of forming 3-D circuits with integrated passive devices
INVENSAS CORP0 citations52