Inventor
LIAO TSUNG JEN
TW18 patents
⚠️ This page may combine multiple inventors who share the name “LIAO TSUNG JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHIPMOS TECHNOLOGIES INC
9 patentsUS8836144B2Sep 16, 2014
Wafer level package structure
CHIPMOS TECHNOLOGIES INC5 citations83
US9269643B2Feb 23, 2016
Chip package structure
CHIPMOS TECHNOLOGIES INC4 citations72
US9437542B2Sep 6, 2016
Chip package structure
CHIPMOS TECHNOLOGIES INC2 citations61
US9087912B2Jul 21, 2015
Method for wafer level packaging and a package structure thereof
CHIPMOS TECHNOLOGIES INC3 citations61
US9576820B2Feb 21, 2017
Semiconductor structure and method of manufacturing the same
CHIPMOS TECHNOLOGIES INC0 citations51
US9190324B2Nov 17, 2015
Manufacturing method for micro bump structure
CHIPMOS TECHNOLOGIES INC0 citations51
US9123684B2Sep 1, 2015
Chip package structure and manufacturing method thereof
CHIPMOS TECHNOLOGIES INC1 citations51
US9018772B2Apr 28, 2015
Chip structure and multi-chip stack package
CHIPMOS TECHNOLOGIES INC1 citations51
US8980695B2Mar 17, 2015
Manufacturing method of wafer level package
CHIPMOS TECHNOLOGIES INC0 citations51
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS10679877B2Jun 9, 2020
Carrier tape system and methods of using carrier tape system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12159847B2Dec 3, 2024
Integrated fan-out structures and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527499B2Dec 13, 2022
Integrated fan-out structures and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11164764B2Nov 2, 2021
Carrier tape system and methods of using carrier tape system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11164763B2Nov 2, 2021
Carrier tape system and methods of using carrier tape system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10879098B2Dec 29, 2020
Semiconductor chip holder
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36