P

Inventor

KIM JAE MYUN

KR11 patents
⚠️ This page may combine multiple inventors who share the name “KIM JAE MYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HYUNDAI ELECTRONICS IND

3 patents
US6380615B1Apr 30, 2002

Chip size stack package, memory module having the same, and method of fabricating the module

HYUNDAI ELECTRONICS IND95 citations97
US6121682ASep 19, 2000

Multi-chip package

HYUNDAI ELECTRONICS IND96 citations96
US6380629B1Apr 30, 2002

Wafer level stack package and method of fabricating the same

HYUNDAI ELECTRONICS IND45 citations91

HYNIX SEMICONDUCTOR INC

3 patents
US7825504B2Nov 2, 2010

Semiconductor package and multi-chip semiconductor package using the same

HYNIX SEMICONDUCTOR INC8 citations83
US7989943B2Aug 2, 2011

Staircase shaped stacked semiconductor package

HYNIX SEMICONDUCTOR INC15 citations82
US7759807B2Jul 20, 2010

Semiconductor package having structure for warpage prevention

HYNIX SEMICONDUCTOR INC2 citations61

HWANG IN CHUL

1 patent
US9064862B2Jun 23, 2015

Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages

HWANG IN CHUL9 citations83

KIM JAE MYUN

1 patent
US8390114B2Mar 5, 2013

Semiconductor package

KIM JAE MYUN12 citations79

SK HYNIX INC

1 patent
US8492889B2Jul 23, 2013

Semiconductor package

SK HYNIX INC2 citations62

MIN BOK GYU

1 patent
US8242582B2Aug 14, 2012

Semiconductor package and stacked semiconductor package having the same

MIN BOK GYU0 citations46

NAH DA UN

1 patent
US8304879B2Nov 6, 2012

Spiral staircase shaped stacked semiconductor package and method for manufacturing the same

NAH DA UN0 citations42