Inventor
TSENG CHIA-HSUN
TW14 patents
Patents
14 patentsUS9660022B2May 23, 2017
Semiconductive device with a single diffusion break and method of fabricating the same
UNITED MICROELECTRONICS CORP17 citations84
US9470987B1Oct 18, 2016
Overlay mask
UNITED MICROELECTRONICS CORP5 citations82
US9548216B1Jan 17, 2017
Method of adjusting channel widths of semiconductive devices
UNITED MICROELECTRONICS CORP9 citations79
US9583343B2Feb 28, 2017
Method of forming non-continuous line pattern and non-continuous line pattern structure
UNITED MICROELECTRONICS CORP2 citations70
US9653345B1May 16, 2017
Method of fabricating semiconductor structure with improved critical dimension control
UNITED MICROELECTRONICS CORP2 citations68
US9583568B2Feb 28, 2017
Semiconductor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations52
US9543203B1Jan 10, 2017
Method of fabricating a semiconductor structure with a self-aligned contact
UNITED MICROELECTRONICS CORP0 citations52
US9746786B2Aug 29, 2017
Overlay mask
UNITED MICROELECTRONICS CORP1 citations51
US9673040B2Jun 6, 2017
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations51
US9530646B2Dec 27, 2016
Method of forming a semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US9581898B2Feb 28, 2017
Manufacturing method of pattern transfer mask
UNITED MICROELECTRONICS CORP0 citations50
US9711358B2Jul 18, 2017
Method of forming non-continuous line pattern and non-continuous line pattern structure
UNITED MICROELECTRONICS CORP0 citations49
US10573649B2Feb 25, 2020
Semiconductor device and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations41
US9964866B2May 8, 2018
Method of forming integrated circuit
UNITED MICROELECTRONICS CORP0 citations41