Inventor
PING ZHAN
US33 patents
⚠️ This page may combine multiple inventors who share the name “PING ZHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
30 patentsUS10114778B2Oct 30, 2018
Multi-protocol IO infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD29 citations93
US10824499B2Nov 3, 2020
Memory system architectures using a separate system control path or channel for processing error information
SAMSUNG ELECTRONICS CO LTD12 citations85
US11460898B2Oct 4, 2022
Advanced thermal control for SSD
SAMSUNG ELECTRONICS CO LTD4 citations84
US10698460B2Jun 30, 2020
Advanced thermal control for SSD
SAMSUNG ELECTRONICS CO LTD6 citations84
US10002044B2Jun 19, 2018
Memory devices and modules
SAMSUNG ELECTRONICS CO LTD6 citations84
US10996896B2May 4, 2021
Solid state drive multi-card adapter with integrated processing
SAMSUNG ELECTRONICS CO LTD3 citations83
US10360166B2Jul 23, 2019
Multi-protocol io infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD5 citations83
US9804920B2Oct 31, 2017
Rank and page remapping logic in a volatile memory
SAMSUNG ELECTRONICS CO LTD7 citations83
US10365981B2Jul 30, 2019
Adaptive multipath fabric for balanced performance and high availability
SAMSUNG ELECTRONICS CO LTD8 citations82
US12197259B2Jan 14, 2025
Active disturbance rejection based thermal control
SAMSUNG ELECTRONICS CO LTD1 citations73
US10193377B2Jan 29, 2019
Semiconductor energy harvest and storage system for charging an energy storage device and powering a controller and multi-sensor memory module
SAMSUNG ELECTRONICS CO LTD3 citations73
US9841904B2Dec 12, 2017
Scalable and configurable non-volatile memory module array
SAMSUNG ELECTRONICS CO LTD2 citations73
US10776299B2Sep 15, 2020
Multi-protocol I/O infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD1 citations72
US11709528B2Jul 25, 2023
Active disturbance rejection based thermal control
SAMSUNG ELECTRONICS CO LTD1 citations71
US11693747B2Jul 4, 2023
Adaptive multipath fabric for balanced performance and high availability
SAMSUNG ELECTRONICS CO LTD2 citations71
US10809780B2Oct 20, 2020
Active disturbance rejection based thermal control
SAMSUNG ELECTRONICS CO LTD1 citations71
US12530154B2Jan 20, 2026
Solid state drive multi-card adapter with integrated processing
SAMSUNG ELECTRONICS CO LTD0 citations62
US12321296B2Jun 3, 2025
Multi-protocol IO infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD0 citations62
US12197260B2Jan 14, 2025
Advanced thermal control for SSD
SAMSUNG ELECTRONICS CO LTD0 citations62
US11907150B2Feb 20, 2024
Multi-protocol IO infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD0 citations62
US11775224B2Oct 3, 2023
Solid state drive multi-card adapter with integrated processing
SAMSUNG ELECTRONICS CO LTD0 citations62
US11755085B2Sep 12, 2023
Advanced thermal control for SSD
SAMSUNG ELECTRONICS CO LTD0 citations62
US11650764B2May 16, 2023
Solid state drive multi-card adapter with integrated processing
SAMSUNG ELECTRONICS CO LTD0 citations62
US11003609B2May 11, 2021
Multi-protocol IO infrastructure for a flexible storage platform
SAMSUNG ELECTRONICS CO LTD0 citations62
US10466923B2Nov 5, 2019
Modular non-volatile flash memory blade
SAMSUNG ELECTRONICS CO LTD2 citations62
US12181984B2Dec 31, 2024
Adaptive multipath fabric for balanced performance and high availability
SAMSUNG ELECTRONICS CO LTD0 citations61
US11263508B2Mar 1, 2022
Modular NGSFF module to meet different density and length requirements
SAMSUNG ELECTRONICS CO LTD0 citations52
US9342136B2May 17, 2016
Dynamic thermal budget allocation for multi-processor systems
SAMSUNG ELECTRONICS CO LTD0 citations52
US10747473B2Aug 18, 2020
Solid state drive multi-card adapter with integrated processing
SAMSUNG ELECTRONICS CO LTD0 citations51
US9946664B2Apr 17, 2018
Socket interposer having a multi-modal I/O interface
SAMSUNG ELECTRONICS CO LTD0 citations42