Inventor

LEE LEE HAN MENG@EUGENE

MY22 patents

⚠️ This page may combine multiple inventors who share the name “LEE LEE HAN MENG@EUGENE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE LEE HAN MENG@EUGENE

TEXAS INSTRUMENTS INC

Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns

Integrated circuit package and method of making

Method of making leadframe strip

Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns

Universal semiconductor package molds

Spring bar leadframe, method and packaged electronic device with zero draft angle

Integrated circuit module with dual leadframe

Method of making leadframe strip

Cutting a leadframe assembly with a plurality of punching tools

Spring bar leadframe, method and packaged electronic device with zero draft angle

Integrated circuit package having an IC die between top and bottom leadframes

Electronic device with lead pitch gap

Making an integrated circuit module with dual leadframes

LEE LEE HAN MENG EUGENE

Tie bar and mold cavity bar arrangements for multiple leadframe stack package

Flexible routing for high current module application

Three piece mold cavity design for packaging integrated circuits

Module package with embedded substrate and leadframe

Exposed die package that helps protect the exposed die from damage

LI FELIX C

Delamination resistant device package having low moisture sensitivity

Delamination resistant device package having raised bond surface and mold locking aperture

NAT SEMICONDUCTOR CORP

TO263 device package having low moisture sensitivity

LEE SHAW WEI

Leadframe packages having enhanced ground-bond reliability