Inventor

BRODSKY WILLIAM L

US106 patents

⚠️ This page may combine multiple inventors who share the name “BRODSKY WILLIAM L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRODSKY WILLIAM L

IBM

Tamper-respondent assemblies with enclosure-to-board protection

Tamper-respondent assemblies with enclosure-to-board protection

Thermally enhanced lid for multichip modules

Portable external flexible cable and package using same

Connector assembly including bilayered elastomeric member

Circuitized structure including flexible circuit with elastomeric member bonded thereto

Tamper-respondent assemblies with enclosure-to-board protection

Enclosure with inner tamper-respondent sensor(s)

Enclosure with inner tamper-respondent sensor(s)

Overlapping, discrete tamper-respondent sensors

Printed wiring board thickness control for compression connectors used in electronic packaging

Tamper-respondent assemblies with bond protection

Tamper-respondent assemblies with bond protection

Thermal pillow

Thermally enhanced lid for multichip modules

Non-planar surface for semiconductor chips

Electrical connector system with member having layers of different durometer elastomeric materials

Land grid array connector and method for forming the same

Electrical connector assembly including pressure exertion member

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit boards and electronic packages with embedded tamper-respondent sensor

Tamper-respondent assemblies with enclosure-to-board protection

Circuit layouts of tamper-respondent sensors

Circuit layouts of tamper-respondent sensors

Noise level tracking and notification system

Tamper-respondent assemblies

Tamper-respondent assemblies

Electrical arc protection using a trip contact

Electromagnetic gaskets for a cable connection

DIMM connector region vias and routing

Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications

Validating connection, structural characteristics and positioning of cable connectors

Sandwiched organic LGA structure

Particle distribution interposer and method of manufacture thereof

Apparatus and method for mechanical coupling of land grid array applications

Electrical coupling of substrates by conductive buttons

Printed wiring board with improved plated through hole fatigue life

Enhanced thermal path mechanical tolerance system

Method of positioning flexible circuit members on a common circuit member

Apparatus for extracting and inserting a DIMM

Temporary removable module lid

Power card connection structure

Acoustic attenuating ear muffs with mechanically actuated attenuation plugs

Hybrid cable assembly having shielded and unshielded portions

Overlapping, discrete tamper-respondent sensors

Method of fabricating a tamper-respondent sensor assembly

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit boards and electronic packages with embedded tamper-respondent sensor

Overlapping, discrete tamper-respondent sensors

BEAMAN BRIAN S

Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing