Inventor

CHUNG YE CHUNG

KR21 patents

⚠️ This page may combine multiple inventors who share the name “CHUNG YE CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHUNG YE CHUNG

SAMSUNG ELECTRONICS CO LTD

Tape package having test pad on reverse surface and method for testing the same

Semiconductor chip and TAB package having the same

Display driver integrated circuit device, film, and module

Semiconductor chip and tab package having the same

Low-cost flexible film package module and method of manufacturing the same

Tape circuit substrate and semiconductor chip package using the same

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Film carrier tape for semiconductor package and manufacturing method thereof

Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device

TAB package connecting host device element

Tab package connecting host device element

Film for a package substrate

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package

Semiconductor packages and display devices including the same

Semiconductor packages and display devices including the same

Source driver, an image display assembly and an image display apparatus

Display driver integrated circuit device, film, and module

SAMSUNG ELECTRIC

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package

CHOI KYOUNG-SEI

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

CHUNG YE-CHUNG

Source driver, an image display assembly and an image display apparatus

CHO YOUNG-SANG

Semiconductor package