Inventor
HUA YU
CN21 patents
⚠️ This page may combine multiple inventors who share the name “HUA YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIV TONGJI
8 patentsUS11345934B1May 31, 2022
Method for anaerobically fermenting organic solid waste
UNIV TONGJI0 citations61
US11618872B2Apr 4, 2023
Anaerobic digestion device based on self-sustained air flotation
UNIV TONGJI0 citations51
US11193104B2Dec 7, 2021
System for high-value utilization of organic solid waste
UNIV TONGJI0 citations51
US11073459B2Jul 27, 2021
Method for evaluating an pretreatment effect for organic solid waste based on fractal dimension
UNIV TONGJI0 citations51
US12508635B2Dec 30, 2025
Integrated system for anaerobic digestion of organic solid waste
UNIV TONGJI0 citations50
US12044475B2Jul 23, 2024
Thermal pretreatment method and equipment for organic solid waste based on forced hot air convection
UNIV TONGJI0 citations50
US11344934B2May 31, 2022
Method for harmlessly pretreating organic solid waste based on combination of calcium ion and hydrothermal treatment
UNIV TONGJI0 citations50
US11156539B2Oct 26, 2021
Method for evaluating bioavailability of organic solid waste by anaerobic conversion based on fractal dimension
UNIV TONGJI0 citations50
BYD CO LTD
6 patentsUS9849771B2Dec 26, 2017
Transmission unit, power transmission system and vehicle comprising the same
BYD CO LTD8 citations80
US10252608B2Apr 9, 2019
Transmission unit, power transmission system and vehicle comprising the same
BYD CO LTD4 citations72
US11827091B2Nov 28, 2023
Vehicle transmission apparatus and vehicle
BYD CO LTD2 citations64
US11053989B2Jul 6, 2021
Locking device, power assembly, power transmission system, and vehicle
BYD CO LTD1 citations60
US11359697B2Jun 14, 2022
Locking device, power assembly, power transmission system, and vehicle
BYD CO LTD0 citations50
US9499038B2Nov 22, 2016
Integrated hybrid power assembly and vehicle comprising the same
BYD CO LTD0 citations38
SEMICONDUCTOR MFG INT SHANGHAI CORP
3 patentsUS9653312B2May 16, 2017
Sealing structure for a bonded wafer and method of forming the sealing structure
SEMICONDUCTOR MFG INT SHANGHAI CORP2 citations64
US11109171B2Aug 31, 2021
Semiconductor device and manufacture thereof
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations60
US10587971B2Mar 10, 2020
Semiconductor device and manufacture thereof
SEMICONDUCTOR MFG INT SHANGHAI CORP0 citations50