Inventor
KIM SEOK HWAN
KR60 patents
⚠️ This page may combine multiple inventors who share the name “KIM SEOK HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
15 patentsUS7104609B2Sep 12, 2006
Longitudinal extension mechanism of armrest
HYUNDAI MOTOR CO LTD43 citations92
US7044550B2May 16, 2006
Rear seat having a backrest implemented with a back board
HYUNDAI MOTOR CO LTD20 citations92
US7404606B2Jul 29, 2008
Device maintaining height of an active headrest
HYUNDAI MOTOR CO LTD13 citations84
US6773067B2Aug 10, 2004
Reclining device for a rear seat of an automobile
HYUNDAI MOTOR CO LTD14 citations84
US7878080B2Feb 1, 2011
Apparatus for adjusting position of vertebral column of dummy model for estimating feeling of sitting in seat
HYUNDAI MOTOR CO LTD11 citations81
US7891259B2Feb 22, 2011
Human dummy system for evaluating comfort of seat
HYUNDAI MOTOR CO LTD12 citations78
US9580585B2Feb 28, 2017
High-flow and high-impact polyolefin resin composition
HYUNDAI MOTOR CO LTD4 citations69
US11364830B2Jun 21, 2022
Apparatus for adjusting height of headrest for motor vehicle
HYUNDAI MOTOR CO LTD3 citations67
US10626210B2Apr 21, 2020
Method of producing methacrylate block copolymer
HYUNDAI MOTOR CO LTD2 citations63
US12275361B2Apr 15, 2025
Seat power supply device for vehicle and power supply method using the same
HYUNDAI MOTOR CO LTD0 citations61
US7712387B2May 11, 2010
Pelvis assembly for dummy model
HYUNDAI MOTOR CO LTD3 citations60
US11827126B2Nov 28, 2023
Power supply and signal transmission device for vehicle seat rail
HYUNDAI MOTOR CO LTD0 citations58
US12415446B2Sep 16, 2025
Tether anchor of seatback of vehicle seat
HYUNDAI MOTOR CO LTD0 citations57
US10351735B2Jul 16, 2019
Conductive adhesive and bonding method of composite material using the conductive adhesive
HYUNDAI MOTOR CO LTD0 citations52
US10363708B2Jul 30, 2019
Composition for preparing lightweight transparent composite, method of preparing composite using the same and composite prepared thereby
HYUNDAI MOTOR CO LTD0 citations51
LG CHEMICAL LTD
14 patentsUS11732069B2Aug 22, 2023
Polypropylene and method for preparing the same
LG CHEMICAL LTD0 citations62
US11370851B2Jun 28, 2022
Transition metal compound and method for preparing polypropylene using the same
LG CHEMICAL LTD0 citations62
US11248072B2Feb 15, 2022
Polypropylene and method for preparing the same
LG CHEMICAL LTD0 citations62
US12358938B2Jul 15, 2025
Transition metal compound and method of preparing polypropylene using the same
LG CHEMICAL LTD0 citations61
US12134674B2Nov 5, 2024
Transition metal compound and catalyst composition comprising the same
LG CHEMICAL LTD0 citations61
US12098158B2Sep 24, 2024
Transition metal compound, catalyst composition and method for preparing polypropylene using the same
LG CHEMICAL LTD0 citations61
US11759977B2Sep 19, 2023
Polypropylene resin pellet and method for preparing the same
LG CHEMICAL LTD0 citations61
US11731123B2Aug 22, 2023
Method of preparing supported metallocene catalyst and method of preparing polypropylene using catalyst prepared thereby
LG CHEMICAL LTD0 citations61
US11504706B2Nov 22, 2022
Method of preparing supported metallocene catalyst and method of preparing polypropylene using catalyst prepared thereby
LG CHEMICAL LTD0 citations61
US12065560B2Aug 20, 2024
Propylene-ethylene random copolymer
LG CHEMICAL LTD0 citations60
US12221498B2Feb 11, 2025
Polyolefin
LG CHEMICAL LTD0 citations51
US11913923B2Feb 27, 2024
Method for evaluating properties of melt-blown plastic resin
LG CHEMICAL LTD0 citations50
US12421334B2Sep 23, 2025
Hybrid supported metallocene catalyst and method of preparing polypropylene using the same
LG CHEMICAL LTD0 citations49
US12528891B2Jan 20, 2026
Hybrid supported metallocene catalyst and method for preparing polypropylene using the same
LG CHEMICAL LTD0 citations48
SAMSUNG ELECTRO MECH
7 patentsUS10957670B2Mar 23, 2021
Package-on-package and package connection system comprising the same
SAMSUNG ELECTRO MECH2 citations70
US10692818B2Jun 23, 2020
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations63
US10467450B2Nov 5, 2019
Fan-out sensor package
SAMSUNG ELECTRO MECH1 citations62
US12422642B2Sep 23, 2025
Camera module
SAMSUNG ELECTRO MECH0 citations61
US12013550B2Jun 18, 2024
Aperture module and camera module
SAMSUNG ELECTRO MECH0 citations59
US12063428B2Aug 13, 2024
Camera module
SAMSUNG ELECTRO MECH0 citations58
US11683569B2Jun 20, 2023
Optical assembly
SAMSUNG ELECTRO MECH0 citations50
SAMSUNG ELECTRONICS CO LTD
6 patentsUS11132308B2Sep 28, 2021
Semiconductor device and semiconductor system
SAMSUNG ELECTRONICS CO LTD2 citations73
US11742308B2Aug 29, 2023
Semiconductor package for reducing stress to redistribution via
SAMSUNG ELECTRONICS CO LTD0 citations62
US10504855B2Dec 10, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US10734342B2Aug 4, 2020
Semiconductor package for reducing stress to redistribution via
SAMSUNG ELECTRONICS CO LTD0 citations52
US10714440B2Jul 14, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10403588B2Sep 3, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
KOREA INST SCI & TECH
2 patentsIREVO INC
1 patentKIM DAE SIK
1 patentHYUNDAI WELDING CO LTD
1 patentMA JEONG J
1 patentKIM SEOK HWAN
1 patentLEE GEUN BAE
1 patentShowing the top 50 of 60 patents by PatentIndex Score.