Inventor
THOMPSON PATRICK FRANCIS
US13 patents
Patents
13 patentsUS11942386B2Mar 26, 2024
Electronic devices in semiconductor package cavities
TEXAS INSTRUMENTS INC2 citations72
US11562949B2Jan 24, 2023
Semiconductor package including undermounted die with exposed backside metal
TEXAS INSTRUMENTS INC6 citations68
US12347742B2Jul 1, 2025
IC package with heat spreader
TEXAS INSTRUMENTS INC0 citations62
US12009280B2Jun 11, 2024
IC package with heat spreader
TEXAS INSTRUMENTS INC0 citations62
US12255115B2Mar 18, 2025
Electronic devices in semiconductor package cavities
TEXAS INSTRUMENTS INC0 citations61
US11984418B2May 14, 2024
Method of forming brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US11410947B2Aug 9, 2022
Brass-coated metals in flip-chip redistribution layers
TEXAS INSTRUMENTS INC0 citations61
US12525500B2Jan 13, 2026
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US11837518B2Dec 5, 2023
Coated semiconductor dies
TEXAS INSTRUMENTS INC0 citations60
US11616038B2Mar 28, 2023
Interconnect for electronic device
TEXAS INSTRUMENTS INC0 citations60
US11855024B2Dec 26, 2023
Wafer chip scale packages with visible solder fillets
TEXAS INSTRUMENTS INC0 citations59
US12009319B2Jun 11, 2024
Integrated circuit with metal stop ring outside the scribe seal
TEXAS INSTRUMENTS INC0 citations50
US10833036B2Nov 10, 2020
Interconnect for electronic device
TEXAS INSTRUMENTS INC0 citations50