Inventor
HSIEH PING-YIN
TW10 patents
Patents
10 patentsUS12033912B2Jul 9, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11081369B2Aug 3, 2021
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12068173B2Aug 20, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699597B2Jul 11, 2023
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12494401B2Dec 9, 2025
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12463108B2Nov 4, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12278162B2Apr 15, 2025
Coplanar control for film-type thermal interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11973005B2Apr 30, 2024
Coplanar control for film-type thermal interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12500134B2Dec 16, 2025
Package assembly including a package lid having a step region and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10679915B2Jun 9, 2020
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51