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Inventor

BURGHOUT WILLIAM F

US8 patents
⚠️ This page may combine multiple inventors who share the name “BURGHOUT WILLIAM F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMICONDUCTOR COMPONENTS IND

4 patents
US6081031AJun 27, 2000

Semiconductor package consisting of multiple conductive layers

SEMICONDUCTOR COMPONENTS IND27 citations92
US9034733B2May 19, 2015

Semiconductor die singulation method

SEMICONDUCTOR COMPONENTS IND5 citations83
US7588999B2Sep 15, 2009

Method of forming a leaded molded array package

SEMICONDUCTOR COMPONENTS IND4 citations61
US7820528B2Oct 26, 2010

Method of forming a leaded molded array package

SEMICONDUCTOR COMPONENTS IND0 citations51

SEMICONDUCTOR COMPONENTS IND LLC

2 patents
US9484210B2Nov 1, 2016

Semiconductor die singulation method

SEMICONDUCTOR COMPONENTS IND LLC7 citations83
US9847219B2Dec 19, 2017

Semiconductor die singulation method

SEMICONDUCTOR COMPONENTS IND LLC2 citations72

BURGHOUT WILLIAM F

1 patent
US8664089B1Mar 4, 2014

Semiconductor die singulation method

BURGHOUT WILLIAM F19 citations87

LETTERMAN JR JAMES P

1 patent
US8319323B2Nov 27, 2012

Electronic package having down-set leads and method

LETTERMAN JR JAMES P10 citations79