Inventor

CARNEY FRANCIS J

US114 patents

⚠️ This page may combine multiple inventors who share the name “CARNEY FRANCIS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CARNEY FRANCIS J

SEMICONDUCTOR COMPONENTS IND LLC

Semiconductor device and method of forming micro interconnect structures

Semiconductor package with elastic coupler and related methods

Semiconductor device and method of aligning semiconductor wafers for bonding

Method for removing material from a substrate using in-situ thickness measurement

Semiconductor device and method of aligning semiconductor wafers for bonding

Flip chip bonding alloys

Semiconductor package with elastic coupler and related methods

Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel

Embedded stacked die packages and related methods

Curved semiconductor die systems and related methods

Semiconductor device and method of forming micro interconnect structures

Through-substrate via structure and method of manufacture

Semiconductor device and method of forming micro interconnect structures

Thinned semiconductor package and related methods

Through-substrate via structure and method of manufacture

Multichip module supports and related methods

Semiconductor packages with thin die and related methods

Semiconductor packages with die including cavities and related methods

Semiconductor packages with an intermetallic layer

Through-substrate via structure and method of manufacture

Semiconductor device and method of forming cantilevered protrusion on a semiconductor die

Semiconductor package with elastic coupler and related methods

Method for insulating singulated electronic die

Semiconductor package with elastic coupler and related methods

Embedded stacked die packages and related methods

Die support for enlarging die size

Semiconductor device and method of forming a curved image sensor

Semiconductor package electrical contact structures and related methods

Curved semiconductor die systems and related methods

Non-planar semiconductor packaging systems and related methods

MOTOROLA INC

Interconnect system and method of fabrication

Electrical interconnect and method for forming the same

Microelectronic package including a polymer encapsulated die

Optoelectronic device and method of assembly

Microelectronic package including a polymer encapsulated die, and method for forming same

Electronic component for aligning a light transmitting structure

Semiconductor chip package and method of forming

Semiconductor package having an exposed die surface

Polyimide optical waveguide having electrical conductivity

Plasma removal of unwanted material

Nitride removal method

Method for plating tab leads in an assembled semiconductor package

SEMICONDUCTOR COMPONENTS IND

Semiconductor package structure having multiple heat dissipation paths and method of manufacture

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Semiconductor package structure having enhanced thermal dissipation characteristics

Robust power semiconductor package

Method for insulating singulated electronic die

SEDDON MICHAEL J

Method of thinning a semiconductor wafer using a film frame

(unassigned)

Thermoplastic interconnect for electronic device and method for making