Inventor
FAUTY JOSEPH K
US19 patents
⚠️ This page may combine multiple inventors who share the name “FAUTY JOSEPH K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND
17 patentsUS6164523ADec 26, 2000
Electronic component and method of manufacture
SEMICONDUCTOR COMPONENTS IND137 citations99
US6081031AJun 27, 2000
Semiconductor package consisting of multiple conductive layers
SEMICONDUCTOR COMPONENTS IND27 citations92
US6768186B2Jul 27, 2004
Semiconductor device and laminated leadframe package
SEMICONDUCTOR COMPONENTS IND20 citations88
US7298034B2Nov 20, 2007
Multi-chip semiconductor connector assemblies
SEMICONDUCTOR COMPONENTS IND12 citations83
US7202105B2Apr 10, 2007
Multi-chip semiconductor connector assembly method
SEMICONDUCTOR COMPONENTS IND12 citations83
US7439100B2Oct 21, 2008
Encapsulated chip scale package having flip-chip on lead frame structure and method
SEMICONDUCTOR COMPONENTS IND13 citations81
US7656048B2Feb 2, 2010
Encapsulated chip scale package having flip-chip on lead frame structure
SEMICONDUCTOR COMPONENTS IND7 citations71
US7901990B2Mar 8, 2011
Method of forming a molded array package device having an exposed tab and structure
SEMICONDUCTOR COMPONENTS IND5 citations62
US7875964B2Jan 25, 2011
Multi-chip semiconductor connector and method
SEMICONDUCTOR COMPONENTS IND2 citations62
US7602054B2Oct 13, 2009
Method of forming a molded array package device having an exposed tab and structure
SEMICONDUCTOR COMPONENTS IND2 citations62
US7202106B2Apr 10, 2007
Multi-chip semiconductor connector and method
SEMICONDUCTOR COMPONENTS IND3 citations62
US7588999B2Sep 15, 2009
Method of forming a leaded molded array package
SEMICONDUCTOR COMPONENTS IND4 citations61
US7508060B2Mar 24, 2009
Multi-chip semiconductor connector assemblies
SEMICONDUCTOR COMPONENTS IND2 citations59
US7820528B2Oct 26, 2010
Method of forming a leaded molded array package
SEMICONDUCTOR COMPONENTS IND0 citations51
US7598123B2Oct 6, 2009
Semiconductor component and method of manufacture
SEMICONDUCTOR COMPONENTS IND0 citations51
US7498195B2Mar 3, 2009
Multi-chip semiconductor connector assembly method
SEMICONDUCTOR COMPONENTS IND0 citations51
US7109064B2Sep 19, 2006
Method of forming a semiconductor package and leadframe therefor
SEMICONDUCTOR COMPONENTS IND0 citations40