Inventor
TSAI WUN-KAI
TW6 patents
⚠️ This page may combine multiple inventors who share the name “TSAI WUN-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS11721662B2Aug 8, 2023
Wafer bonding method and wafer bonding apparatus
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12057301B2Aug 6, 2024
Arcing protection method, processing tool and fabrication system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US11664206B2May 30, 2023
Arcing protection method and processing tool
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations56
US10847490B2Nov 24, 2020
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US10396054B2Aug 27, 2019
Bonding alignment tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48