Inventor

YODER JAY A

US25 patents

⚠️ This page may combine multiple inventors who share the name “YODER JAY A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YODER JAY A

SEMICONDUCTOR COMPONENTS IND

Semiconductor die singulation method

Multi-chip semiconductor connector assemblies

Multi-chip semiconductor connector assembly method

Multi-chip semiconductor connector and method

Multi-chip semiconductor connector and method

Method of forming a leaded molded array package

Multi-chip semiconductor connector assemblies

Method of forming a leaded molded array package

Semiconductor component and method of manufacture

Multi-chip semiconductor connector assembly method

SEMICONDUCTOR COMPONENTS IND LLC

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Semiconductor package structures and methods of manufacture

Single or multi chip module package and related methods

Holes and dimples to control solder flow

Single or multi chip module package and related methods

Single or multi chip module package and related methods

HARVARD COLLEGE

Control of insect pests

Control of insect pests

BURGHOUT WILLIAM F

Semiconductor die singulation method

LETTERMAN JR JAMES P

Electronic package having down-set leads and method

CARNEY FRANCIS J

Multi-chip semiconductor connector

KNAPP JAMES HOWARD

Method of marking a low profile packaged semiconductor device