Inventor

YANG YONGBO

CN4 patents

⚠️ This page may combine multiple inventors who share the name “YANG YONGBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UTAC HEADQUARTERS PTE LTD

2 patents

US9786625B2Oct 10, 2017

Semiconductor packages and methods of packaging semiconductor devices

UTAC HEADQUARTERS PTE LTD3 citations68

US10403592B2Sep 3, 2019

Semiconductor packages and methods of packaging semiconductor devices

UTAC HEADQUARTERS PTE LTD0 citations47

UNITED TEST & ASSEMBLY CT LT

1 patent

US9087777B2Jul 21, 2015

Semiconductor packages and methods of packaging semiconductor devices

UNITED TEST & ASSEMBLY CT LT3 citations57

HARBIN WELDING INST CO LTD

1 patent

US12472577B2Nov 18, 2025

Lateral electro-conduction device and method for multi-wire submerged arc inner/outer welding of straight-seam steel pipe

HARBIN WELDING INST CO LTD0 citations37