Inventor
CHUN JUNG HWAN
KR12 patents
⚠️ This page may combine multiple inventors who share the name “CHUN JUNG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS6608380B2Aug 19, 2003
Semiconductor chip package having one or more sealing screws
SAMSUNG ELECTRONICS CO LTD10 citations72
US11114544B2Sep 7, 2021
Integrated circuit device having fin-type active
SAMSUNG ELECTRONICS CO LTD2 citations71
US11955531B2Apr 9, 2024
Method of forming an integrated circuit device having a contact capping layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11626503B2Apr 11, 2023
Integrated circuit device having fin-type active
SAMSUNG ELECTRONICS CO LTD0 citations61
US12279449B2Apr 15, 2025
Semiconductor devices having upper and lower active contacts
SAMSUNG ELECTRONICS CO LTD0 citations51
US12490481B2Dec 2, 2025
Semiconductor devices and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations45
CHUN JUNG HWAN
4 patentsUS8952514B2Feb 10, 2015
Semiconductor package
CHUN JUNG HWAN5 citations69
US8222120B2Jul 17, 2012
Method of dicing wafer using plasma
CHUN JUNG HWAN4 citations54
US8202744B2Jun 19, 2012
Wafer through silicon via forming method and equipment therefor
CHUN JUNG HWAN0 citations43
US9024452B2May 5, 2015
Semiconductor package comprising an interposer and method of manufacturing the same
CHUN JUNG HWAN0 citations38