Inventor
XU YI
CN258 patents
⚠️ This page may combine multiple inventors who share the name “XU YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
21 patentsUS6436824B1Aug 20, 2002
Low dielectric constant materials for copper damascene
CHARTERED SEMICONDUCTOR MFG175 citations99
US6348407B1Feb 19, 2002
Method to improve adhesion of organic dielectrics in dual damascene interconnects
CHARTERED SEMICONDUCTOR MFG250 citations99
US6265321B1Jul 24, 2001
Air bridge process for forming air gaps
CHARTERED SEMICONDUCTOR MFG148 citations99
US6683002B1Jan 27, 2004
Method to create a copper diffusion deterrent interface
CHARTERED SEMICONDUCTOR MFG71 citations98
US6358842B1Mar 19, 2002
Method to form damascene interconnects with sidewall passivation to protect organic dielectrics
CHARTERED SEMICONDUCTOR MFG141 citations98
US6165891ADec 26, 2000
Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer
CHARTERED SEMICONDUCTOR MFG87 citations98
US6331479B1Dec 18, 2001
Method to prevent degradation of low dielectric constant material in copper damascene interconnects
CHARTERED SEMICONDUCTOR MFG84 citations97
US6124194ASep 26, 2000
Method of fabrication of anti-fuse integrated with dual damascene process
CHARTERED SEMICONDUCTOR MFG90 citations97
US6424044B1Jul 23, 2002
Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization
CHARTERED SEMICONDUCTOR MFG99 citations96
US6352921B1Mar 5, 2002
Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization
CHARTERED SEMICONDUCTOR MFG64 citations95
US6117747ASep 12, 2000
Integration of MOM capacitor into dual damascene process
CHARTERED SEMICONDUCTOR MFG73 citations95
US6690091B1Feb 10, 2004
Damascene structure with reduced capacitance using a boron carbon nitride passivation layer, etch stop layer, and/or cap layer
CHARTERED SEMICONDUCTOR MFG29 citations93
US6350675B1Feb 26, 2002
Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects
CHARTERED SEMICONDUCTOR MFG55 citations93
US6720204B2Apr 13, 2004
Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding
CHARTERED SEMICONDUCTOR MFG38 citations92
US6475810B1Nov 5, 2002
Method of manufacturing embedded organic stop layer for dual damascene patterning
CHARTERED SEMICONDUCTOR MFG24 citations92
US6429117B1Aug 6, 2002
Method to create copper traps by modifying treatment on the dielectrics surface
CHARTERED SEMICONDUCTOR MFG21 citations92
US6417088B1Jul 9, 2002
Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG44 citations92
US6378759B1Apr 30, 2002
Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG37 citations92
US6207554B1Mar 27, 2001
Gap filling process in integrated circuits using low dielectric constant materials
CHARTERED SEMICONDUCTOR MFG39 citations90
US6350689B1Feb 26, 2002
Method to remove copper contamination by using downstream oxygen and chelating agent plasma
CHARTERED SEMICONDUCTOR MFG15 citations84
US5930677AJul 27, 1999
Method for reducing microloading in an etchback of spin-on-glass or polymer
CHARTERED SEMICONDUCTOR MFG17 citations79
GEN ELECTRIC
4 patentsUS9259844B2Feb 16, 2016
Vision-guided electromagnetic robotic system
GEN ELECTRIC67 citations96
US9804282B2Oct 31, 2017
Computer-assisted fault interpretation of seismic data
GEN ELECTRIC8 citations84
US9194965B2Nov 24, 2015
System and method for X-ray image acquisition and processing
GEN ELECTRIC7 citations84
US9465997B2Oct 11, 2016
System and method for detection and tracking of moving objects
GEN ELECTRIC13 citations82
ZOOX INC
3 patentsBEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO LTD
2 patentsCAPSO VISION INC
2 patentsTEXAS A & M UNIV SYS
2 patentsUS7615616B2Nov 10, 2009
Bioinformatic method for identifying surface-anchored proteins from gram-positive bacteria and proteins obtained thereby
TEXAS A & M UNIV SYS14 citations89
US7850974B2Dec 14, 2010
Bioinformatic method for identifying surface-anchored proteins from gram-positive bacteria and proteins obtained thereby
TEXAS A & M UNIV SYS9 citations81
VERKADA INC
2 patentsPIXTECH INC
1 patentKUMAR SHANKAR
1 patentTEXAS A & M UNIVERISITY SYSTEM
1 patentCHINA PETROCHEMICAL CORP
1 patentJIANGSU JIANGHUAI ENGINE CO LT
1 patentJIANGSU JIANGHUAI ENGINE CO LTD
1 patentXU YI
1 patentCAPSOVISION INC
1 patentADVANCED MICRO DEVICES INC
1 patentINNOCOM TECH SHENZHEN CO LTD
1 patentAGRAWAL AMIT
1 patentGOVERNING COUNCIL UNIV TORONTO
1 patentSHENZHEN DORABOT INC
1 patentALIBABA CHINA CO LTD
1 patentShowing the top 50 of 258 patents by PatentIndex Score.