Inventor · disambiguated record
Akihiro Horiguchi
Also filed as: HORIGUCHI AKIHIRO
24 granted patents·912 citations·filing 1987–2001
97Inventor score
Top patents by PatentIndex Score
24 records- 0197US6310282B1Photovoltaic conversion element and a dye-sensitizing photovoltaic cellTOSHIBA KK·Filed 2000·Granted Oct 30, 2001·135 cites·22 claims
- 0294US5541926AATM cell assembly and disassembly device with enhanced data handling flexibilityTOSHIBA KK·Filed 1993·Granted Jul 30, 1996·216 cites·20 claims
- 0391US7061862B2Inter-network relay system and methodTOSHIBA KK·Filed 2001·Granted Jun 13, 2006·96 cites·12 claims
- 0490US4770953AAluminum nitride sintered body having conductive metallized layerTOSHIBA KK·Filed 1987·Granted Sep 13, 1988·87 cites·19 claims
- 0580US4847221AAlN sintered body having high thermal conductivity and a method of fabricating the sameTOSHIBA KK·Filed 1988·Granted Jul 11, 1989·30 cites·25 claims
- 0671US5001089AAluminum nitride sintered bodyTOSHIBA KK·Filed 1989·Granted Mar 19, 1991·22 cites·10 claims
- 0769US6086990AHigh thermal conductivity silicon nitride circuit substrate and semiconductor device using the sameTOSHIBA KK·Filed 1996·Granted Jul 11, 2000·38 cites·8 claims
- 0866US5176309AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1991·Granted Jan 5, 1993·31 cites·11 claims
- 0964US6781994B1Distributing ATM cells to output ports based upon destination information using ATM switch core and IP forwardingTOSHIBA KK·Filed 1998·Granted Aug 24, 2004·59 cites·7 claims
- 1064US4883780AAluminum nitride sintered body and preparation thereofTOSHIBA KK·Filed 1988·Granted Nov 28, 1989·17 cites·8 claims
- 1162US5286927AMethod of manufacturing circuit board and circuit board itself manufactured by said methodTOSHIBA KK·Filed 1992·Granted Feb 15, 1994·26 cites·9 claims
- 1262US5184399AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1991·Granted Feb 9, 1993·27 cites·16 claims
- 1361US6107638ASilicon nitride circuit substrate and semiconductor device containing sameTOSHIBA KK·Filed 1998·Granted Aug 22, 2000·26 cites·9 claims
- 1460US5280850AMethod of manufacturing circuit boardTOSHIBA KK·Filed 1992·Granted Jan 25, 1994·24 cites·11 claims
- 1554US6110596ASilicon nitride ceramic circuit substrate and semiconductor device using the sameTOSHIBA KK·Filed 1996·Granted Aug 29, 2000·19 cites·18 claims
- 1649US5204080AMethod of manufacturing an aluminum nitride structureTOSHIBA KK·Filed 1990·Granted Apr 20, 1993·8 cites·5 claims
- 1746US5616956ACircuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing sameTOSHIBA KK·Filed 1995·Granted Apr 1, 1997·14 cites·32 claims
- 1843US6013356ACircuit board with high strength and high reliability and process for preparing the sameTOSHIBA KK·Filed 1996·Granted Jan 11, 2000·11 cites·17 claims
- 1939US5284537AMethod of manufacturing aluminum nitride structure with anisotropic propertiesTOSHIBA KK·Filed 1992·Granted Feb 8, 1994·4 cites·6 claims
- 2038US5409869AAluminum nitride sintered body, method for manufacturing the same, and ceramic circuit boardTOSHIBA KK·Filed 1993·Granted Apr 25, 1995·8 cites·5 claims
- 2135US5641718ASintered aluminum nitride and circuit substrate using sintered aluminum nitrideTOSHIBA KK·Filed 1995·Granted Jun 24, 1997·6 cites·26 claims
- 2234US5500395AMethod for manufacturing an aluminum nitride sintered bodyTOSHIBA KK·Filed 1994·Granted Mar 19, 1996·5 cites·12 claims
- 2331US5182540AElectrical resistor element and method of manufacturing the sameTOSHIBA KK·Filed 1991·Granted Jan 26, 1993·2 cites·17 claims
- 2423US5126293ALight-shielding a delta n sintered body and method of manufacturing the sameKOSHIBA KK·Filed 1990·Granted Jun 30, 1992·1 cites·10 claims
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