Inventor
BUCHWALTER LEENA P
US8 patents
Patents
8 patentsUS6184121B1Feb 6, 2001
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM369 citations98
US6577011B1Jun 10, 2003
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM86 citations97
US6255217B1Jul 3, 2001
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM78 citations94
US5133840AJul 28, 1992
Surface midification of a polyimide
IBM40 citations92
US6261951B1Jul 17, 2001
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM34 citations91
US5340451AAug 23, 1994
Process for producing a metal organic polymer combination
IBM22 citations91
US6593660B2Jul 15, 2003
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM11 citations72
US7199450B2Apr 3, 2007
Materials and method to seal vias in silicon substrates
IBM2 citations62