Inventor
GOLDBLATT RONALD D
US11 patents
Patents
11 patentsUS6534863B2Mar 18, 2003
Common ball-limiting metallurgy for I/O sites
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US5208068AMay 4, 1993
Lamination method for coating the sidewall or filling a cavity in a substrate
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US7098676B2Aug 29, 2006
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor
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US6395164B1May 28, 2002
Copper seed layer repair technique using electroless touch-up
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US5357005AOct 18, 1994
Reactive surface functionalization
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US5340451AAug 23, 1994
Process for producing a metal organic polymer combination
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US5019210AMay 28, 1991
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
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US7294565B2Nov 13, 2007
Method of fabricating a wire bond pad with Ni/Au metallization
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US5178914AJan 12, 1993
Means of seeding and metallizing polymide
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US6339022B1Jan 15, 2002
Method of annealing copper metallurgy
IBM6 citations59
US9666749B2May 30, 2017
Low resistance, low reflection, and low cost contact grids for photovoltaic cells
IBM0 citations51