Inventor
HEIDENREICH III JOHN E
US7 patents
Patents
7 patentsUS5298720AMar 29, 1994
Method and apparatus for contamination control in processing apparatus containing voltage driven electrode
IBM53 citations95
US5340451AAug 23, 1994
Process for producing a metal organic polymer combination
IBM22 citations91
US5019210AMay 28, 1991
Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
IBM40 citations89
US6339024B1Jan 15, 2002
Reinforced integrated circuits
IBM8 citations73
US6750113B2Jun 15, 2004
Metal-insulator-metal capacitor in copper
IBM12 citations69
US7087997B2Aug 8, 2006
Copper to aluminum interlayer interconnect using stud and via liner
IBM4 citations61
US7037824B2May 2, 2006
Copper to aluminum interlayer interconnect using stud and via liner
IBM2 citations61