Inventor
KYUNG YOU-JIN
KR23 patents
⚠️ This page may combine multiple inventors who share the name “KYUNG YOU-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG CHEMICAL LTD
19 patentsUS7709153B2May 4, 2010
Multi-component composite film method for preparing the same
LG CHEMICAL LTD48 citations97
US7470488B2Dec 30, 2008
Multi-component composite film method for preparing the same
LG CHEMICAL LTD97 citations97
US7014948B2Mar 21, 2006
Electrochemical device using multicomponent composite membrane film
LG CHEMICAL LTD121 citations97
US7087269B2Aug 8, 2006
Multi-component composite membrane and method for preparing the same
LG CHEMICAL LTD20 citations92
US6830849B2Dec 14, 2004
High crystalline polypropylene microporous membrane, multi-component microporous membrane and methods for preparing the same
LG CHEMICAL LTD22 citations92
US11527503B2Dec 13, 2022
Method for manufacturing semiconductor package
LG CHEMICAL LTD2 citations72
US12286564B2Apr 29, 2025
Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same
LG CHEMICAL LTD0 citations61
US12448490B2Oct 21, 2025
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
LG CHEMICAL LTD0 citations59
US12024654B2Jul 2, 2024
Non-conductive film and manufacturing method of semiconductor laminate
LG CHEMICAL LTD0 citations59
US11702520B2Jul 18, 2023
Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
LG CHEMICAL LTD0 citations59
US11515245B2Nov 29, 2022
Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same
LG CHEMICAL LTD0 citations59
US11993731B2May 28, 2024
Adhesive composition for semiconductor circuit connection and adhesive film containing the same
LG CHEMICAL LTD0 citations51
US9778566B2Oct 3, 2017
Photocurable and thermocurable resin composition and dry film solder resist
LG CHEMICAL LTD0 citations51
US11361878B2Jun 14, 2022
Method for manufacturing insulating film and semiconductor package
LG CHEMICAL LTD0 citations50
US10795259B2Oct 6, 2020
Photo-curable and heat-curable resin composition and dry film solder resist
LG CHEMICAL LTD0 citations50
US7491447B2Feb 17, 2009
Double-sided metallic laminate and method for manufacturing the same
LG CHEMICAL LTD1 citations50
US9410017B2Aug 9, 2016
Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
LG CHEMICAL LTD0 citations41
US8354219B2Jan 15, 2013
Photosensitive resin composition and dry film comprising the same
LG CHEMICAL LTD0 citations41
US9788434B2Oct 10, 2017
Preparation method for dry film solder resist and film laminate used therein
LG CHEMICAL LTD0 citations40