Inventor
HIGASHINO TOMOKO
JP13 patents
⚠️ This page may combine multiple inventors who share the name “HIGASHINO TOMOKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
4 patentsUS6750080B2Jun 15, 2004
Semiconductor device and process for manufacturing the same
RENESAS TECH CORP24 citations92
US7148081B2Dec 12, 2006
Method of manufacturing a semiconductor device
RENESAS TECH CORP14 citations84
US7563642B2Jul 21, 2009
Manufacturing method of a semiconductor device
RENESAS TECH CORP12 citations83
US7514294B2Apr 7, 2009
Semiconductor device and a manufacturing method of the same
RENESAS TECH CORP5 citations62
RENESAS ELECTRONICS CORP
4 patentsUS7892949B2Feb 22, 2011
Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
RENESAS ELECTRONICS CORP31 citations91
US10002808B2Jun 19, 2018
Semiconductor device manufacturing method and semiconductor device
RENESAS ELECTRONICS CORP2 citations72
US9070560B2Jun 30, 2015
Semiconductor chip with modified regions for dividing the chip
RENESAS ELECTRONICS CORP1 citations61
US9006036B2Apr 14, 2015
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations36
ABE YOSHIYUKI
2 patentsUS8084334B2Dec 27, 2011
Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
ABE YOSHIYUKI4 citations72
US8772135B2Jul 8, 2014
Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof
ABE YOSHIYUKI0 citations51