Inventor

NOVESKI VLADIMIR

US10 patents

⚠️ This page may combine multiple inventors who share the name “NOVESKI VLADIMIR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV NORTH CAROLINA STATE

2 patents

US7678195B2Mar 16, 2010

Seeded growth process for preparing aluminum nitride single crystals

UNIV NORTH CAROLINA STATE46 citations90

US7632454B2Dec 15, 2009

Dense, shaped articles constructed of a refractory material and methods of preparing such articles

UNIV NORTH CAROLINA STATE12 citations80

QUALCOMM INC

2 patents

US9806063B2Oct 31, 2017

Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability

QUALCOMM INC9 citations82

US10037941B2Jul 31, 2018

Integrated device package comprising photo sensitive fill between a substrate and a die

QUALCOMM INC0 citations50

FARAHANI MOHAMMAD M

2 patents

US8174084B2May 8, 2012

Stress sensor for in-situ measurement of package-induced stress in semiconductor devices

FARAHANI MOHAMMAD M5 citations69

US8586393B2Nov 19, 2013

Stress sensor for in-situ measurement of package-induced stress in semiconductor devices

FARAHANI MOHAMMAD M3 citations58

ALEKSOV ALEKSANDAR

2 patents

US8186051B2May 29, 2012

Method for fabricating package substrate and die spacer layers having a ceramic backbone

ALEKSOV ALEKSANDAR1 citations61

US8604353B2Dec 10, 2013

Package substrate and die spacer layers having a ceramic backbone

ALEKSOV ALEKSANDAR0 citations51

SCHLESSER RAOUL

1 patent

US8414677B2Apr 9, 2013

Dense, shaped articles constructed of a refractory material and methods of preparing such articles

SCHLESSER RAOUL2 citations56

INTEL CORP

1 patent

US9258880B2Feb 9, 2016

Package substrate and die spacer layers having a ceramic backbone

INTEL CORP0 citations51