P

Inventor

CHENG CHIA-MING

TW62 patents
⚠️ This page may combine multiple inventors who share the name “CHENG CHIA-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XINTEC INC

29 patents
US8803326B2Aug 12, 2014

Chip package

XINTEC INC7 citations84
US12341109B2Jun 24, 2025

Chip package and manufacturing method thereof

XINTEC INC1 citations75
US11784134B2Oct 10, 2023

Chip package and manufacturing method thereof

XINTEC INC1 citations73
US11521938B2Dec 6, 2022

Chip package including substrate inclined sidewall and redistribution line

XINTEC INC3 citations73
US9887229B2Feb 6, 2018

Sensing chip package and a manufacturing method thereof

XINTEC INC2 citations73
US10424540B2Sep 24, 2019

Chip package and method for forming the same

XINTEC INC2 citations72
US11450697B2Sep 20, 2022

Chip package with substrate having first opening surrounded by second opening and method for forming the same

XINTEC INC2 citations71
US10446504B2Oct 15, 2019

Chip package and method for forming the same

XINTEC INC5 citations70
US9601460B2Mar 21, 2017

Chip package including recess in side edge

XINTEC INC2 citations70
US12477848B2Nov 18, 2025

Chip package and method for forming the same

XINTEC INC0 citations63
US11749618B2Sep 5, 2023

Chip package including substrate having through hole and redistribution line

XINTEC INC0 citations63
US9349710B2May 24, 2016

Chip package and method for forming the same

XINTEC INC2 citations63
US8633091B2Jan 21, 2014

Chip package and fabrication method thereof

XINTEC INC2 citations63
US9318461B2Apr 19, 2016

Wafer level array of chips and method thereof

XINTEC INC2 citations62
US11973095B2Apr 30, 2024

Method for forming chip package with second opening surrounding first opening having conductive structure therein

XINTEC INC1 citations61
US11355659B2Jun 7, 2022

Chip package and manufacturing method thereof

XINTEC INC0 citations61
US10714528B2Jul 14, 2020

Chip package and manufacturing method thereof

XINTEC INC1 citations61
US11387201B2Jul 12, 2022

Chip package and manufacturing method thereof

XINTEC INC0 citations60
US11164853B1Nov 2, 2021

Chip package and manufacturing method thereof

XINTEC INC0 citations52
US9799588B2Oct 24, 2017

Chip package and manufacturing method thereof

XINTEC INC0 citations52
US9640488B2May 2, 2017

Chip package and method for forming the same

XINTEC INC0 citations52
US9620431B2Apr 11, 2017

Chip package including recess in side edge

XINTEC INC1 citations52
US9373597B2Jun 21, 2016

Chip package and method thereof

XINTEC INC0 citations52
US9275958B2Mar 1, 2016

Chip package and method for forming the same

XINTEC INC1 citations52
US9064950B2Jun 23, 2015

Fabrication method for a chip package

XINTEC INC0 citations52
US9034681B2May 19, 2015

Chip package and method for forming the same

XINTEC INC0 citations52
US9018770B2Apr 28, 2015

Chip package

XINTEC INC0 citations52
US8822325B2Sep 2, 2014

Chip package and fabrication method thereof

XINTEC INC0 citations52
US9165890B2Oct 20, 2015

Chip package comprising alignment mark and method for forming the same

XINTEC INC1 citations51

MEDIATEK INC

11 patents

TSAI CHIA-LUN

2 patents

UNITED MICROELECTRONICS CORP

2 patents

FOURSTAR GROUP INC

1 patent

CHENG CHIA-MING

1 patent

CHIU HSIN-CHIH

1 patent

PERNG BAW-CHING

1 patent

LIN TA-HSUAN

1 patent

LIU TSANG-YU

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.