Inventor

LEE EUNG SUEK

KR10 patents

⚠️ This page may combine multiple inventors who share the name “LEE EUNG SUEK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

6 patents

US9837343B2Dec 5, 2017

Chip embedded substrate

SAMSUNG ELECTRO MECH5 citations73

US8377748B2Feb 19, 2013

Method of manufacturing cooling fin and package substrate with cooling fin

SAMSUNG ELECTRO MECH2 citations61

US9673066B2Jun 6, 2017

Apparatus and method of manufacturing semiconductor package module

SAMSUNG ELECTRO MECH0 citations51

US7810232B2Oct 12, 2010

Method of manufacturing a circuit board

SAMSUNG ELECTRO MECH1 citations48

US7473099B2Jan 6, 2009

Printed circuit board and manufacturing method thereof

SAMSUNG ELECTRO MECH1 citations48

US7973248B2Jul 5, 2011

Printed circuit board using paste bump and manufacturing method thereof

SAMSUNG ELECTRO MECH0 citations38

LEE EUNG SUEK

1 patent

US8633396B2Jan 21, 2014

Die mounting substrate and method of fabricating the same

LEE EUNG SUEK2 citations55

MOK JEE SOO

1 patent

US8592135B2Nov 26, 2013

Method of manufacturing printed circuit board

MOK JEE SOO0 citations50

HWANG MI SUN

1 patent

US8415200B2Apr 9, 2013

Method for manufacturing semiconductor package

HWANG MI SUN0 citations47

HWANG JUN-OH

1 patent

US8166647B2May 1, 2012

Method of manufacturing a printed circuit board

HWANG JUN-OH0 citations43