Inventor

JANG KIYOUN

KR29 patents

⚠️ This page may combine multiple inventors who share the name “JANG KIYOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JANG KIYOUN

STATS CHIPPAC LTD

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers

Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection

SAMSUNG ELECTRONICS CO LTD

Electronic device having wireless power transmitting/receiving conductive pattern

Electronic device including cooling function and controlling method thereof

Electronic device having wireless power transmitting/receiving conductive pattern

Electronic device and method for controlling cooling function of external electronic device

Electronic device including heat transfer member

Method to charge battery and electronic device including battery

Electronic device including battery

Pouch-type flexible battery

LEE JAEHYUN

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate

Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure

LEE KYUNGHOON

Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material

Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance

PAGAILA REZA A

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

JANG KIYOUN

Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

CHO SUNGWON

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate