Inventor
ERICKSON DUSTIN WILLIAM
US8 patents
⚠️ This page may combine multiple inventors who share the name “ERICKSON DUSTIN WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS9559296B2Jan 31, 2017
Method for providing a perpendicular magnetic anisotropy magnetic junction usable in spin transfer torque magnetic devices using a sacrificial insertion layer
SAMSUNG ELECTRONICS CO LTD1 citations51
US9806253B2Oct 31, 2017
Method for providing a high perpendicular magnetic anisotropy layer in a magnetic junction usable in spin transfer torque magnetic devices using multiple anneals
SAMSUNG ELECTRONICS CO LTD0 citations40
US9799382B2Oct 24, 2017
Method for providing a magnetic junction on a substrate and usable in a magnetic device
SAMSUNG ELECTRONICS CO LTD0 citations40
US9735350B2Aug 15, 2017
Method and system for removing boron from magnetic junctions usable in spin transfer torque memory applications
SAMSUNG ELECTRONICS CO LTD0 citations40
US9559143B2Jan 31, 2017
Method and system for providing magnetic junctions including free layers that are cobalt-free
SAMSUNG ELECTRONICS CO LTD0 citations40
US9472750B2Oct 18, 2016
Method and system for providing a bottom pinned layer in a perpendicular magnetic junction usable in spin transfer torque magnetic random access memory applications
SAMSUNG ELECTRONICS CO LTD0 citations40
US10164175B2Dec 25, 2018
Method and system for providing a magnetic junction usable in spin transfer torque applications using multiple stack depositions
SAMSUNG ELECTRONICS CO LTD0 citations38