P

Inventor

CAO ZHITAO

US8 patents
⚠️ This page may combine multiple inventors who share the name “CAO ZHITAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLE INC

5 patents
US11309246B2Apr 19, 2022

High density 3D interconnect configuration

APPLE INC10 citations85
US10102962B1Oct 16, 2018

Integrated magnetic passive devices using magnetic film

APPLE INC7 citations81
US12119304B2Oct 15, 2024

Very fine pitch and wiring density organic side by side chiplet integration

APPLE INC2 citations72
US11735526B2Aug 22, 2023

High density 3D interconnect configuration

APPLE INC1 citations72
US12159835B2Dec 3, 2024

High density 3D interconnect configuration

APPLE INC0 citations62

APPLIED MATERIALS INC

2 patents
US10115573B2Oct 30, 2018

Apparatus for high compressive stress film deposition to improve kit life

APPLIED MATERIALS INC0 citations51
US9960023B2May 1, 2018

Methods and apparatus for nodule control in a titanium-tungsten target

APPLIED MATERIALS INC0 citations51

CAO ZHITAO

1 patent
US8835308B2Sep 16, 2014

Methods for depositing materials in high aspect ratio features

CAO ZHITAO2 citations53