Inventor
SHUTO TAKASHI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “SHUTO TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS10522483B2Dec 31, 2019
Package assembly for embedded die and associated techniques and configurations
INTEL CORP37 citations96
US9685414B2Jun 20, 2017
Package assembly for embedded die and associated techniques and configurations
INTEL CORP11 citations82
US10014263B2Jul 3, 2018
Package assembly for embedded die and associated techniques and configurations
INTEL CORP3 citations71
US10304785B2May 28, 2019
Package assembly for embedded die and associated techniques and configurations
INTEL CORP0 citations51
US9887110B2Feb 6, 2018
Substrate warpage control using temper glass with uni-directional heating
INTEL CORP0 citations51
FUJITSU LTD
4 patentsUS7002080B2Feb 21, 2006
Multilayer wiring board
FUJITSU LTD69 citations98
US7152314B2Dec 26, 2006
Method of manufacturing circuit board
FUJITSU LTD21 citations90
US7377030B2May 27, 2008
Wiring board manufacturing method
FUJITSU LTD6 citations71
US7935891B2May 3, 2011
Wiring board manufacturing method
FUJITSU LTD0 citations52