Inventor
SEYAMA KIYOTAKA
JP14 patents
Patents
14 patentsUS5894882AApr 20, 1999
Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure
FUJITSU LTD60 citations96
US5586006ADec 17, 1996
Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
FUJITSU LTD59 citations95
US5862038AJan 19, 1999
Cooling device for mounting module
FUJITSU LTD77 citations94
US5432675AJul 11, 1995
Multi-chip module having thermal contacts
FUJITSU LTD63 citations94
US6693362B2Feb 17, 2004
Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
FUJITSU LTD42 citations92
US5608192AMar 4, 1997
Multilayer thin-film wiring board
FUJITSU LTD32 citations92
US4949219AAug 14, 1990
Module sealing structure
FUJITSU LTD27 citations92
US4912603AMar 27, 1990
High density printed wiring board
FUJITSU LTD32 citations92
US5181317AJan 26, 1993
Method of making an engineering change to a printed wiring board
FUJITSU LTD9 citations73
US7377030B2May 27, 2008
Wiring board manufacturing method
FUJITSU LTD6 citations71
US6959125B2Oct 25, 2005
Printed board unit for optical transmission and mounting method
FUJITSU LTD9 citations71
US6057168AMay 2, 2000
Method for forming bumps using dummy wafer
FUJITSU LTD14 citations71
US5166867ANov 24, 1992
Bus bar for a circuit board
FUJITSU LTD14 citations70
US7935891B2May 3, 2011
Wiring board manufacturing method
FUJITSU LTD0 citations52