Inventor
SIL DEVIKA
US6 patents
Patents
6 patentsUS11309216B2Apr 19, 2022
Large grain copper interconnect lines for MRAM
IBM3 citations71
US11114606B2Sep 7, 2021
MRAM devices containing a harden gap fill dielectric material
IBM6 citations71
US10978342B2Apr 13, 2021
Interconnect with self-forming wrap-all-around barrier layer
IBM0 citations62
US11756786B2Sep 12, 2023
Forming high carbon content flowable dielectric film with low processing damage
IBM0 citations60
US12272545B2Apr 8, 2025
Embedded metal contamination removal from BEOL wafers
IBM0 citations50
US11302637B2Apr 12, 2022
Interconnects including dual-metal vias
IBM0 citations50