Inventor
SHIKA SEIJI
JP10 patents
Patents
10 patentsUS7192651B2Mar 20, 2007
Resin composition and prepreg for laminate and metal-clad laminate
MITSUBISHI GAS CHEMICAL CO38 citations91
US11680139B2Jun 20, 2023
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO4 citations72
US11466123B2Oct 11, 2022
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO2 citations70
US12312323B2May 27, 2025
Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations59
US11767287B2Sep 26, 2023
Compound and method for producing the same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations59
US12133339B2Oct 29, 2024
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations50
US11370857B2Jun 28, 2022
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations50
US11643493B2May 9, 2023
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US11447658B2Sep 20, 2022
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US9351397B2May 24, 2016
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same
MITSUBISHI GAS CHEMICAL CO0 citations36