Inventor
UPADHYAYULA SURESH
US18 patents
⚠️ This page may combine multiple inventors who share the name “UPADHYAYULA SURESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES INC
6 patentsUS8987053B2Mar 24, 2015
Semiconductor package including flip chip controller at bottom of die stack
SANDISK TECHNOLOGIES INC5 citations84
US8373268B2Feb 12, 2013
Semiconductor package including flip chip controller at bottom of die stack
SANDISK TECHNOLOGIES INC10 citations84
US8986050B2Mar 24, 2015
Connector of a universal serial bus device
SANDISK TECHNOLOGIES INC3 citations62
US8022417B2Sep 20, 2011
Method of assembling semiconductor devices with LEDS
SANDISK TECHNOLOGIES INC3 citations62
US8008132B2Aug 30, 2011
Etched surface mount islands in a leadframe package
SANDISK TECHNOLOGIES INC5 citations57
US9218953B2Dec 22, 2015
Low profile wire bonded USB device
SANDISK TECHNOLOGIES INC0 citations51
SANDISK CORP
5 patentsUSD524817SJul 11, 2006
Portable memory storage device
SANDISK CORP33 citations91
US7354314B1Apr 8, 2008
Electrical connector with grounding pin
SANDISK CORP10 citations82
US7867819B2Jan 11, 2011
Semiconductor package including flip chip controller at bottom of die stack
SANDISK CORP6 citations73
US7384817B2Jun 10, 2008
Method of assembling semiconductor devices with LEDs
SANDISK CORP6 citations73
US7812356B2Oct 12, 2010
Method of assembling semiconductor devices with LEDS
SANDISK CORP0 citations52
UPADHYAYULA SURESH
4 patentsUS8947883B2Feb 3, 2015
Low profile wire bonded USB device
UPADHYAYULA SURESH9 citations82
US8637779B2Jan 28, 2014
Electronic component including micro balls
UPADHYAYULA SURESH0 citations48
US8659133B2Feb 25, 2014
Etched surface mount islands in a leadframe package
UPADHYAYULA SURESH0 citations45
US8575739B2Nov 5, 2013
Col-based semiconductor package including electrical connections through a single layer leadframe
UPADHYAYULA SURESH0 citations39