Inventor
YOO JE-GWANG
KR37 patents
⚠️ This page may combine multiple inventors who share the name “YOO JE-GWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
20 patentsUS7947906B2May 24, 2011
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH19 citations92
US7886433B2Feb 15, 2011
Method of manufacturing a component-embedded PCB
SAMSUNG ELECTRO MECH29 citations92
US7529439B2May 5, 2009
Optical printed circuit board and fabricating method thereof
SAMSUNG ELECTRO MECH22 citations92
US7992291B2Aug 9, 2011
Method of manufacturing a circuit board
SAMSUNG ELECTRO MECH9 citations84
US7489839B2Feb 10, 2009
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH9 citations84
US7707715B2May 4, 2010
Method of fabricating multilayer printed circuit board
SAMSUNG ELECTRO MECH18 citations83
US7809220B2Oct 5, 2010
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH7 citations74
US7991250B2Aug 2, 2011
Printed circuit board
SAMSUNG ELECTRO MECH5 citations63
US7983055B2Jul 19, 2011
Printed circuit board with embedded cavity capacitor
SAMSUNG ELECTRO MECH2 citations63
US7937833B2May 10, 2011
Method of manufacturing circuit board
SAMSUNG ELECTRO MECH4 citations63
US7672547B2Mar 2, 2010
Printed circuit board including optical waveguide and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations63
US7903410B2Mar 8, 2011
Package board and method for manufacturing thereof
SAMSUNG ELECTRO MECH4 citations62
US8377748B2Feb 19, 2013
Method of manufacturing cooling fin and package substrate with cooling fin
SAMSUNG ELECTRO MECH2 citations61
US8022311B2Sep 20, 2011
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations61
US6525463B1Feb 25, 2003
Flat panel display device
SAMSUNG ELECTRO MECH6 citations58
US8048324B2Nov 1, 2011
Method of manufacturing optical waveguide and method of manufacturing package board
SAMSUNG ELECTRO MECH1 citations52
US7697800B2Apr 13, 2010
Method of manufacturing printed circuit board
SAMSUNG ELECTRO MECH1 citations52
US7546002B2Jun 9, 2009
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US7505661B2Mar 17, 2009
Optical waveguide, package board having the same, and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US7592708B2Sep 22, 2009
Package board, semiconductor package, and fabricating method thereof
SAMSUNG ELECTRO MECH0 citations42
KIM HAN
6 patentsUS8966746B2Mar 3, 2015
Method of fabricating cavity capacitor embedded in printed circuit board
KIM HAN2 citations63
US8279616B2Oct 2, 2012
Printed circuit board with embedded chip capacitor
KIM HAN4 citations63
US8158889B2Apr 17, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN4 citations63
US8232478B2Jul 31, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN1 citations52
US8169790B2May 1, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN1 citations52
US8310840B2Nov 13, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN0 citations42