Inventor
MURAYAMA KATSUHIKO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “MURAYAMA KATSUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MAX CO LTD
10 patentsUS7175063B2Feb 13, 2007
Powered nailing machine
MAX CO LTD31 citations92
US7762443B2Jul 27, 2010
Gas combustion type driving tool
MAX CO LTD19 citations84
US7703648B2Apr 27, 2010
Gas combustion type driving tool
MAX CO LTD16 citations84
US7556182B2Jul 7, 2009
Gas combustion type driving tool
MAX CO LTD16 citations84
US7938303B2May 10, 2011
Gas combustion-type driving tool
MAX CO LTD12 citations83
US7686197B2Mar 30, 2010
Gas combustion type striking tool
MAX CO LTD13 citations83
US8025182B2Sep 27, 2011
Gas cartridge
MAX CO LTD11 citations81
US6834666B2Dec 28, 2004
Apparatus for outputting compressed air in compressor
MAX CO LTD12 citations71
US8006880B2Aug 30, 2011
Gas combustion type driving tool
MAX CO LTD5 citations63
US7681758B2Mar 23, 2010
Gas cartridge
MAX CO LTD0 citations49
SUMCO CORP
7 patentsUS7488400B2Feb 10, 2009
Apparatus for etching wafer by single-wafer process
SUMCO CORP7 citations73
US7906438B2Mar 15, 2011
Single wafer etching method
SUMCO CORP5 citations62
US7601644B2Oct 13, 2009
Method for manufacturing silicon wafers
SUMCO CORP6 citations62
US7288207B2Oct 30, 2007
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same
SUMCO CORP4 citations60
US7717768B2May 18, 2010
Wafer polishing apparatus and method for polishing wafers
SUMCO CORP0 citations51
US7648890B2Jan 19, 2010
Process for producing silicon wafer
SUMCO CORP1 citations51
US7955982B2Jun 7, 2011
Method for smoothing wafer surface and apparatus used therefor
SUMCO CORP0 citations41
KOYATA SAKAE
3 patentsUS8759229B2Jun 24, 2014
Method for manufacturing epitaxial wafer
KOYATA SAKAE2 citations60
US8466071B2Jun 18, 2013
Method for etching single wafer
KOYATA SAKAE3 citations60
US8066896B2Nov 29, 2011
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer
KOYATA SAKAE0 citations49