Inventor
KATOH TAKEO
JP14 patents
⚠️ This page may combine multiple inventors who share the name “KATOH TAKEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
9 patentsUS7491342B2Feb 17, 2009
Bonded semiconductor substrate manufacturing method thereof
SUMCO CORP33 citations92
US7488400B2Feb 10, 2009
Apparatus for etching wafer by single-wafer process
SUMCO CORP7 citations73
US8379196B2Feb 19, 2013
Method for judging whether semiconductor wafer is non-defective wafer by using laser scattering method
SUMCO CORP4 citations62
US7906438B2Mar 15, 2011
Single wafer etching method
SUMCO CORP5 citations62
US7601644B2Oct 13, 2009
Method for manufacturing silicon wafers
SUMCO CORP6 citations62
US7648890B2Jan 19, 2010
Process for producing silicon wafer
SUMCO CORP1 citations51
US7955982B2Jun 7, 2011
Method for smoothing wafer surface and apparatus used therefor
SUMCO CORP0 citations41
US10177008B2Jan 8, 2019
Silicon wafer and method for manufacturing the same
SUMCO CORP0 citations40
US7833908B2Nov 16, 2010
Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same
SUMCO CORP0 citations39
KOYATA SAKAE
3 patentsUS8759229B2Jun 24, 2014
Method for manufacturing epitaxial wafer
KOYATA SAKAE2 citations60
US8466071B2Jun 18, 2013
Method for etching single wafer
KOYATA SAKAE3 citations60
US8066896B2Nov 29, 2011
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer
KOYATA SAKAE0 citations49