Inventor
KIM JONGYOUN
KR38 patents
Patents
38 patentsUS10833002B2Nov 10, 2020
Connection structure and method of forming the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US10950539B2Mar 16, 2021
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD5 citations83
US11437310B2Sep 6, 2022
Connection structure and method of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11373954B2Jun 28, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations73
US10319650B2Jun 11, 2019
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11456241B2Sep 27, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11145611B2Oct 12, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US12057435B2Aug 6, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US11929316B2Mar 12, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11646260B2May 9, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10741518B2Aug 11, 2020
Method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10546829B2Jan 28, 2020
Method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US12293989B2May 6, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations64
US12417972B2Sep 16, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12300625B2May 13, 2025
Semiconductor package including outer conductive plate
SAMSUNG ELECTRONICS CO LTD0 citations62
US12243813B2Mar 4, 2025
Connection structure and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12211777B2Jan 28, 2025
Semiconductor package including a dummy pattern
SAMSUNG ELECTRONICS CO LTD0 citations62
US12183690B2Dec 31, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12068270B2Aug 20, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12062621B2Aug 13, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11901276B2Feb 13, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11869835B2Jan 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11810849B2Nov 7, 2023
Connection structure and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11637081B2Apr 25, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11569157B2Jan 31, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11387192B2Jul 12, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394753B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11973028B2Apr 30, 2024
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11600564B2Mar 7, 2023
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11508649B2Nov 22, 2022
Semiconductor package including substrate with outer insulating layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11018108B2May 25, 2021
Method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12230556B2Feb 18, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11948872B2Apr 2, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations60
US10685890B2Jun 16, 2020
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US11837551B2Dec 5, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12525548B2Jan 13, 2026
Semiconductor package including stiffener
SAMSUNG ELECTRONICS CO LTD0 citations48
US12205914B2Jan 21, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations48
US11094636B2Aug 17, 2021
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47