Inventor
LIN PENG-CHENG
US13 patents
⚠️ This page may combine multiple inventors who share the name “LIN PENG-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
10 patentsUS5502289AMar 26, 1996
Stacked multi-chip modules and method of manufacturing
NAT SEMICONDUCTOR CORP342 citations99
US5495398AFeb 27, 1996
Stacked multi-chip modules and method of manufacturing
NAT SEMICONDUCTOR CORP383 citations99
US5422435AJun 6, 1995
Stacked multi-chip modules and method of manufacturing
NAT SEMICONDUCTOR CORP513 citations99
US5428245AJun 27, 1995
Lead frame including an inductor or other such magnetic component
NAT SEMICONDUCTOR CORP119 citations97
US5504370AApr 2, 1996
Electronic system circuit package directly supporting components on isolated subsegments
NAT SEMICONDUCTOR CORP34 citations92
US5415331AMay 16, 1995
Method of placing a semiconductor with die collet having cavity wall recess
NAT SEMICONDUCTOR CORP37 citations92
US5348316ASep 20, 1994
Die collet with cavity wall recess
NAT SEMICONDUCTOR CORP35 citations92
US5339216AAug 16, 1994
Device and method for reducing thermal cycling in a semiconductor package
NAT SEMICONDUCTOR CORP28 citations92
US5901043AMay 4, 1999
Device and method for reducing thermal cycling in a semiconductor package
NAT SEMICONDUCTOR CORP10 citations74
US5491360AFeb 13, 1996
Electronic package for isolated circuits
NAT SEMICONDUCTOR CORP18 citations73