P

Inventor

HAMZEHDOOST AHMAD

US12 patents
⚠️ This page may combine multiple inventors who share the name “HAMZEHDOOST AHMAD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VLSI TECHNOLOGY INC

9 patents
US6069407AMay 30, 2000

BGA package using PCB and tape in a die-up configuration

VLSI TECHNOLOGY INC212 citations98
US5689091ANov 18, 1997

Multi-layer substrate structure

VLSI TECHNOLOGY INC201 citations98
US5430331AJul 4, 1995

Plastic encapsulated integrated circuit package having an embedded thermal dissipator

VLSI TECHNOLOGY INC80 citations96
US5999415ADec 7, 1999

BGA package using PCB and tape in a die-down configuration

VLSI TECHNOLOGY INC80 citations95
US5491362AFeb 13, 1996

Package structure having accessible chip

VLSI TECHNOLOGY INC62 citations94
US5910686AJun 8, 1999

Cavity down HBGA package structure

VLSI TECHNOLOGY INC47 citations92
US5371321ADec 6, 1994

Package structure and method for reducing bond wire inductance

VLSI TECHNOLOGY INC27 citations92
US5687474ANov 18, 1997

Method of assembling and cooling a package structure with accessible chip

VLSI TECHNOLOGY INC25 citations87
US5539151AJul 23, 1996

Reinforced sealing technique for an integrated-circuit package

VLSI TECHNOLOGY INC17 citations81

VLSI TECHNOLOGY CORP

1 patent
US5742009AApr 21, 1998

Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the package leads

VLSI TECHNOLOGY CORP19 citations88

(unassigned)

1 patent
US6468834B1Oct 22, 2002

Method of fabricating a BGA package using PCB and tape in a die-up configuration

3 citations61

PHILIPS ELECTRONICS NA

1 patent
US6264778B1Jul 24, 2001

Reinforced sealing technique for an integrated circuit package

PHILIPS ELECTRONICS NA0 citations47