Inventor
CHAE HYO GEUN
KR6 patents
Patents
6 patentsUS6489790B1Dec 3, 2002
Socket including pressure conductive rubber and mesh for testing of ball grid array package
SAMSUNG ELECTRONICS CO LTD39 citations92
US6450839B1Sep 17, 2002
Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device
SAMSUNG ELECTRONICS CO LTD23 citations89
US6462534B2Oct 8, 2002
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith
SAMSUNG ELECTRONICS CO LTD20 citations81
US7017428B2Mar 28, 2006
Test kit for semiconductor package and method for testing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations61
US6841425B2Jan 11, 2005
Wafer treatment method for protecting fuse box of semiconductor chip
SAMSUNG ELECTRONICS CO LTD3 citations60
US6396294B2May 28, 2002
Socket pin and socket for electrical testing of semiconductor packages
SAMSUNG ELECTRONICS CO LTD6 citations60