Inventor
HUANG HUI YEN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HUI YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HARVATEK CORP
14 patentsUS7671374B2Mar 2, 2010
LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
HARVATEK CORP9 citations84
USD509809SSep 20, 2005
Metal base design for surface mount device LED
HARVATEK CORP10 citations73
USD506732SJun 28, 2005
Light-emitting diode
HARVATEK CORP8 citations73
US7211882B2May 1, 2007
LED package structure and method for making the same
HARVATEK CORP8 citations72
USD506187SJun 14, 2005
Metal base design for surface mount device LED (light emitting diode)
HARVATEK CORP9 citations72
US7803641B2Sep 28, 2010
Mold structure for packaging LED chips and method thereof
HARVATEK CORP5 citations62
US7842964B2Nov 30, 2010
Front and rear covering type LED package structure and method for packaging the same
HARVATEK CORP0 citations52
US7824938B2Nov 2, 2010
Method for manufacturing an LED chip package structure
HARVATEK CORP0 citations52
US7662661B2Feb 16, 2010
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof
HARVATEK CORP1 citations52
US7303984B2Dec 4, 2007
Semiconductor substrate structure and processing method thereof
HARVATEK CORP0 citations52
US12224221B2Feb 11, 2025
Packaging method and package structure
HARVATEK CORP0 citations45
US11699675B2Jul 11, 2023
Semiconductor device with high heat dissipation efficiency
HARVATEK CORP0 citations45
US9887179B2Feb 6, 2018
Light emitting diode device and light emitting device using the same
HARVATEK CORP0 citations39
US10084123B2Sep 25, 2018
Portable light-emitting device without pre-stored power sources and LED package structure thereof
HARVATEK CORP0 citations38