Inventor
CHIBA JUN
JP14 patents
⚠️ This page may combine multiple inventors who share the name “CHIBA JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TANAKA ELECTRONICS IND
4 patentsUS11456271B2Sep 27, 2022
Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
TANAKA ELECTRONICS IND0 citations58
US11251153B2Feb 15, 2022
Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bonding
TANAKA ELECTRONICS IND1 citations58
US9972595B2May 15, 2018
Bonding wire for high-speed signal line
TANAKA ELECTRONICS IND1 citations45
US9362249B2Jun 7, 2016
Silver—gold alloy bonding wire
TANAKA ELECTRONICS IND0 citations45