Inventor

YE DEHONG

CN7 patents

⚠️ This page may combine multiple inventors who share the name “YE DEHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

2 patents

US9362211B1Jun 7, 2016

Exposed pad integrated circuit package with mold lock

FREESCALE SEMICONDUCTOR INC7 citations80

US7887928B2Feb 15, 2011

Coated lead frame

FREESCALE SEMICONDUCTOR INC1 citations51

GONG ZHIWEI

1 patent

US8329509B2Dec 11, 2012

Packaging process to create wettable lead flank during board assembly

GONG ZHIWEI21 citations89

WANG ZHIJIE

1 patent

US9406625B2Aug 2, 2016

Die edge seal employing low-K dielectric material

WANG ZHIJIE14 citations79

GAO WEI

1 patent

US8735223B2May 27, 2014

Semiconductor devices and methods of assembling same

GAO WEI2 citations60

Huang meiquan

1 patent

US8288847B2Oct 16, 2012

Dual die semiconductor package

Huang meiquan4 citations56

NXP USA INC

1 patent

US10283477B2May 7, 2019

Method of fabricating 3-dimensional fan-out structure

NXP USA INC0 citations41